- Manufacturer:
-
- Chip Quik Inc. (3)
- ProhmTect (8)
- Size / Dimension:
-
- Type:
-
- Storage/Refrigeration Temperature:
-
- Usable Temperature Range:
-
- Thermal Conductivity:
-
15 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Chip Quik Inc. | HEAT SINK COMPOU... |
1 |
2
In-stock
|
Get Quote | ||
|
t-Global Technology | SILICONE FREE TH... |
1 |
117
In-stock
|
Get Quote | ||
|
t-Global Technology | SILICONE THERMAL... |
1 |
7
In-stock
|
Get Quote | ||
|
Chip Quik Inc. | HEAT SINK COMPOU... |
1 |
19
In-stock
|
Get Quote | ||
|
Laird Technologies - Thermal Materials | TGREASE 880S 0.5 KG |
1 |
50,000
In-stock
|
Get Quote | ||
|
Laird Technologies - Thermal Materials | TGREASE 880S 1.0 KG |
1 |
50,000
In-stock
|
Get Quote | ||
|
ProhmTect | ELEC THERM COND P... |
1 |
100
In-stock
|
Get Quote | ||
|
ProhmTect | ELEC THERM COND P... |
1 |
100
In-stock
|
Get Quote | ||
|
ProhmTect | LUB COND PASTE J1... |
1 |
100
In-stock
|
Get Quote | ||
|
ProhmTect | ELEC THERM COND P... |
1 |
100
In-stock
|
Get Quote | ||
|
ProhmTect | ELEC THERM COND P... |
1 |
100
In-stock
|
Get Quote | ||
|
ProhmTect | ELEC THERM COND P... |
1 |
100
In-stock
|
Get Quote | ||
|
ProhmTect | ELEC THERM COND P... |
1 |
100
In-stock
|
Get Quote | ||
|
ProhmTect | LUB COND PASTE J1... |
1 |
100
In-stock
|
Get Quote | ||
|
Chip Quik Inc. | HEAT SINK COMPOU... |
1 |
10
In-stock
|
Get Quote |
