- Manufacturer：
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- Bergquist (1)
- Material：
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- Shape：
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- Thermal Conductivity：
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- Outline：
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- Backing, Carrier：
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7 Records
| Image | Part | Manufacturer | Description | MOQ | Stock | Action | |
|---|---|---|---|---|---|---|---|
|
Bergquist | THERM PAD 406.4MMX2... |
1 |
50,000
In-stock
|
Get Quote | ||
|
|
Laird Technologies - Thermal Materials | TFLEX P140 |
1 |
50,000
In-stock
|
Get Quote | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 406.4MMX4... |
1 |
50,000
In-stock
|
Get Quote | ||
|
|
Laird Technologies - Thermal Materials | TPLI 240 GAP FILLE... |
1 |
50,000
In-stock
|
Get Quote | ||
|
|
Laird Technologies - Thermal Materials | TFLEX P140 |
1 |
133
In-stock
|
Get Quote | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
Get Quote | ||
|
|
Laird Technologies - Thermal Materials | THERM PAD 203.2MMX2... |
1 |
50,000
In-stock
|
Get Quote |
