HSB08-212106

Manufacturer :

CUI Devices

Product Category :

Thermal - Heat Sinks

Attachment Method :

Adhesive

Diameter :

-

Fin Height :

0.236" (6.00mm)

Length :

0.827" (21.00mm)

Material :

Aluminum Alloy

Material Finish :

Black Anodized

Package Cooled :

BGA

Power Dissipation @ Temperature Rise :

3.0W @ 75°C

Product Status :

Active

Shape :

Square, Pin Fins

Thermal Resistance @ Forced Air Flow :

9.70°C/W @ 200 LFM

Thermal Resistance @ Natural :

25.40°C/W

Type :

Top Mount

Width :

0.827" (21.00mm)