HSS05-C20-SMT-TR

Manufacturer :

CUI Devices

Product Category :

Thermal - Heat Sinks

Attachment Method :

-

Diameter :

-

Fin Height :

0.390" (9.91mm)

Length :

1.031" (26.20mm)

Material :

Copper Alloy

Material Finish :

Tin

Package Cooled :

TO-220

Power Dissipation @ Temperature Rise :

2.3W @ 75°C

Product Status :

Active

Shape :

Rectangular

Thermal Resistance @ Forced Air Flow :

14.00°C/W @ 200 LFM

Thermal Resistance @ Natural :

32.69°C/W

Type :

Board Level, Vertical

Width :

0.500" (12.70mm)