IW-HSKALU-CLASLR-CU03

Mfr.Part #
IW-HSKALU-CLASLR-CU03
Manufacturer
iWave Systems
Package/Case
-
Datasheet
Download
Description
ZU+ MPSOC SOM MODULE HEATSINK
Stock:
In Stock

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Manufacturer :
iWave Systems
Product Category :
Thermal - Heat Sinks
Attachment Method :
Bolt On
Diameter :
-
Fin Height :
1.181" (30.00mm)
Length :
3.740" (95.00mm)
Material :
Aluminum
Material Finish :
-
Package Cooled :
FPGA
Power Dissipation @ Temperature Rise :
-
Product Status :
Active
Shape :
Rectangular, Fins
Thermal Resistance @ Forced Air Flow :
-
Thermal Resistance @ Natural :
-
Type :
Top Mount
Width :
2.953" (75.00mm)

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