TS391LT10
- Mfr.Part #
- TS391LT10
- Manufacturer
- Chip Quik Inc.
- Package/Case
- -
- Datasheet
- Download
- Description
- THERMALLY STABLE SOLDER PASTE NO
- Stock:
- In Stock
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- Manufacturer :
- Chip Quik Inc.
- Product Category :
- Solder
- Composition :
- Bi57.6Sn42Ag0.4 (57.6/42/0.4)
- Diameter :
- -
- Flux Type :
- No-Clean
- Form :
- Syringe, 1.23 oz (35g), 10cc
- Melting Point :
- 281°F (138°C)
- Mesh Type :
- 4
- Process :
- Lead Free
- Product Status :
- Active
- Shelf Life :
- 12 Months
- Shelf Life Start :
- Date of Manufacture
- Storage/Refrigeration Temperature :
- 68°F ~ 77°F (20°C ~ 25°C)
- Type :
- Solder Paste
- Wire Gauge :
- -
- Datasheets
- TS391LT10
