TS991SNL35T4

Mfr.Part #
TS991SNL35T4
Manufacturer
Chip Quik Inc.
Package/Case
-
Datasheet
Download
Description
THERMALLY STABLE SOLDER PASTE NC
Stock:
In Stock

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Manufacturer :
Chip Quik Inc.
Product Category :
Solder
Composition :
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Diameter :
-
Flux Type :
No-Clean
Form :
Syringe, 1.23 oz (34.869g)
Melting Point :
423°F (217°C)
Mesh Type :
4
Process :
-
Product Status :
Active
Shelf Life :
12 Months
Shelf Life Start :
Date of Manufacture
Storage/Refrigeration Temperature :
37°F ~ 77°F (3°C ~ 25°C)
Type :
Solder Paste
Wire Gauge :
-
Datasheets
TS991SNL35T4

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