BGA0034-S

Mfr.Part #
BGA0034-S
Manufacturer
Chip Quik Inc.
Package/Case
-
Datasheet
Download
Description
BGA-676 (1.0 MM PITCH, 26 X 26 G
Stock:
In Stock

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Manufacturer :
Chip Quik Inc.
Product Category :
Solder Stencils, Templates
Inner Dimension :
1.024" L x 1.024" W (26.00mm x 26.00mm)
Material :
Stainless Steel
Number of Positions :
676
Outer Dimension :
2.600" L x 1.800" W (66.04mm x 45.72mm)
Pitch :
0.039" (1.00mm)
Product Status :
Active
Thermal Center Pad :
-
Type :
BGA
Datasheets
BGA0034-S

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