BMI-C-001-SN

Manufacturer :

Laird Technologies EMI

Product Category :

RFI and EMI - Contacts, Fingerstock and Gaskets

Attachment Method :

Solder

Height :

0.096" (2.44mm)

Length :

0.122" (3.11mm)

Material :

Beryllium Copper

Operating Temperature :

-

Plating :

Tin

Plating - Thickness :

-

Product Status :

Active

Shape :

-

Type :

Shield Finger

Width :

0.079" (2.00mm)