BMI-C-006

Manufacturer :

Laird Technologies EMI

Product Category :

RFI and EMI - Contacts, Fingerstock and Gaskets

Attachment Method :

Solder

Height :

0.100" (2.54mm)

Length :

0.113" (2.86mm)

Material :

Beryllium Copper

Operating Temperature :

-

Plating :

Tin

Plating - Thickness :

-

Product Status :

Active

Shape :

-

Type :

Fingerstock

Width :

0.079" (2.00mm)