BMI-C-004

Manufacturer :

Laird Technologies EMI

Product Category :

RFI and EMI - Contacts, Fingerstock and Gaskets

Attachment Method :

Solder

Height :

0.204" (5.17mm)

Length :

0.235" (5.97mm)

Material :

Beryllium Copper

Operating Temperature :

-

Plating :

Gold

Plating - Thickness :

-

Product Status :

Active

Shape :

-

Type :

Fingerstock

Width :

0.170" (4.32mm)